Products

ESD-safe materials

ESD-Safe Materials

Elect Nano ESD-safe materials use discrete CNT technology to produce static-control compounds across COC, MPPO, LCP, PPSU, and TPU platforms, giving engineering teams options for cleanliness, toughness, temperature resistance, stiffness, and flexibility.

7 available materials listed

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Black COC ESD TGF25 wafer carrier box on a white background

Low-particle COC ESD

COC ESD TGF25

Low-particle COC ESD compound with 25 wt% fine glass fiber for FOUPs and precision semiconductor fixtures.

COCdCNTGlass fiberInjection molding pellets
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Black COC ESD MCF20 FOUP component on a white background

Low-particle COC ESD

COC ESD MCF20

Low-particle COC ESD compound with 20 wt% milled carbon fiber for stiff, dimensionally stable FOUP components.

COCdCNTCarbon fiberInjection molding pellets
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MPPO LP ESD TGF30 JEDEC tray on a white background

High-temperature low-particle ESD

MPPO LP ESD TGF30

High-temperature MPPO ESD compound with 30 wt% thin glass fiber for low-particle molded fixtures and tooling.

MPPOdCNTGlass fiberInjection molding pellets
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LCP LP ESD TGF40 JEDEC tray on a white background

High-temperature low-particle ESD

LCP LP ESD TGF40

High-temperature low-particle LCP ESD compound with 40 wt% thin glass fiber and 330 C HDT.

LCPdCNTGlass fiberInjection molding pellets
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Simulation of LCP LEO DiMiseio™ demisable spacecraft component during atmospheric reentry

Space ESD LCP

LCP LEO DiMiseio™

LEO-focused ESD LCP nanocomposite with thin glass fiber, dCNT uniformity, demisability, AO resistance, and low outgassing.

LCPdCNTGlass fiberInjection molding pellets
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PPSUper Tough™ ESD molded bracket on a white background

Tough ESD PPSU

PPSUper Tough™ ESD

Tough PPSU ESD compound with nano-uniform resistance, 23.5% elongation, no-break unnotched Izod, and 207 C HDT.

PPSUdCNTInjection molding pellets
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Flexible black TPU ESD duct component on a white background

ESD thermoplastic elastomer

TPU 95A ESD

Flexible TPU 95A ESD elastomer with 737.1% elongation and dCNT surface resistance control for soft molded parts.

TPUdCNTThermoplastic elastomer pellets
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Platform Benefits

  • Product line includes cleanroom-oriented COC, MPPO, LCP, PPSU, and TPU platforms
  • Surface resistance options span conductive, dissipative, and higher-resistance ESD ranges
  • Fiber-reinforced grades support stiffness, dimensional control, wear resistance, and low warpage
  • Space-oriented ESD options include demisable and atomic-oxygen-resistant LCP

Applications

FOUPs and semiconductor fixturesCleanroom handling componentsESD-safe trays and carriersDefense electronics hardwareSpacecraft ESD componentsFlexible ESD interfaces

Technical Highlights

LCP LP ESD TGF40 reports 330 C heat deflection temperature and 1E+07 ohm surface resistance
PPSUper Tough™ ESD reports 23.5% elongation at break and 119.3 J/m notched Izod impact
COC ESD grades are positioned for low moisture uptake and ultra-low WVTR cleanroom applications
LCP LEO DiMiseio™ combines ESD control with demisability, low outgassing, and atomic oxygen resistance

Limitations and Qualification Notes

Surface resistance targets must be validated with the end-use test method and molded geometry

Cleanliness, ionic, outgassing, and particle requirements depend on final resin and application environment

High-fiber grades trade impact and elongation against stiffness, dimensional control, and thermal performance

Material sample review

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