Filler distribution
Agglomerates, uneven conductive pathways, or poor dispersion can produce local hot spots and dead zones.
Technical problem
What causes ESD surface resistance variation in molded components?
Resistance variation can come from filler distribution, fiber orientation, flow path, surface exposure, resin choice, test method, humidity, and part geometry.
Problem guide
Uniform electrostatic control is a material system problem.
For semiconductor and electronics handling, a nominal resistance value is not enough. Engineers need controlled variation across the real part, across lots, and across the surfaces that contact sensitive devices.
Flow and orientation
Fiber-filled systems may orient during molding, creating direction-dependent electrical and mechanical behavior.
Surface quality
Exposed filler or rough surfaces can affect cleanliness, marking, handling, and repeatability.
Measurement setup
Probe pressure, humidity, conditioning, geometry, and method selection can shift measured resistance.
Qualification strategy
Useful testing should include multiple locations, multiple parts, and representative geometries.
Material sample review
Need a more uniform ESD-safe material?
Share your target resistance range, part geometry, and qualification method so Elect Nano can recommend an evaluation plan.