Applications
LEO spacecraft hardwareESD-safe satellite componentsDemisable molded partsSpace electronics fixtures
ESD-Safe Materials
Space ESD LCP
LCP LEO DiMiseio™
LCP LEO DiMiseio™ is a space-engineered ESD-safe nanocomposite based on high-flow thermotropic LCP reinforced with 30 wt% thin glass fiber. The formulation uses dCNT technology for uniform electrical properties and a filler package selected for complete atmospheric reentry demisability, with low outgassing, atomic oxygen resistance, low optical reflectance, strong molded surface quality, and high-temperature stability for LEO hardware.
Properties
| Property | Value | Method or Context |
|---|---|---|
| Surface resistance | 1E+07 ohm | ANSI STM11.11 |
| Density | 1.64 g/cm3 | ASTM D792 |
| Tensile strength | 153 MPa | ISO 527-1,2 |
| Flexural strength | 222 MPa | ASTM D790 |
| Thermal conductivity | 0.479 W/(m*K) | ASTM D7984 |
| Heat deflection temperature | 253.5 C | 1.82 MPa |
| CTE, flow direction | 9.04 um/(m*C) | ASTM E831 |
Usage Guide
Processing
- Dry to less than 100 ppm moisture before molding.
- Typical melt temperature window: 280-315 C.
Qualification
- Space use should be validated against mission-specific outgassing, AO, radiation, and demisability requirements.
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