Applications
FOUP componentsSemiconductor manufacturing fixturesCleanroom handling hardwarePrecision molded carriers
ESD-Safe Materials
Low-particle COC ESD
COC ESD TGF25
COC ESD TGF25 is a low-particle, ESD-safe injection molding compound based on cyclic olefin copolymer and reinforced with 25 wt% fine glass fiber. It pairs COC low moisture uptake and ultra-low WVTR with dCNT electrical uniformity, fine-fiber surface finish, low particle sloughing, wear resistance, laser marking contrast, and low warpage for FOUPs and semiconductor manufacturing fixtures.
Properties
| Property | Value | Method or Context |
|---|---|---|
| Surface resistance | 1E+08 ohm | ANSI STM11.11 |
| Density | 1.25 g/cm3 | ASTM D792 |
| Tensile strength | 73.2 MPa | ASTM D638 |
| Tensile modulus | 7.82 GPa | ASTM D638 |
| Flexural strength | 119 MPa | ASTM D790 |
| Heat deflection temperature | 147 C | 1.82 MPa |
Usage Guide
Processing
- Dry to less than 100 ppm moisture before molding.
- Typical melt temperature window: 290-310 C.
Qualification
- Optimized for cleanroom fixtures where cleanliness, dimensional stability, and reliable ESD performance are central.
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